From voids to head-in-pillow: reliably detecting BGA defects with AXI

Hidden solder joints, such as those beneath a BGA package, are among the biggest challenges in electronics manufacturing. This is especially true for double-sided assemblies, where components on the bottom side overlap the BGA solder balls on the top side.

In this webinar, we demonstrate how Multi Line AXI precisely inspects BGAs in 3D volume. Defects such as volume deviations, voids, head-in-pillow, short circuits, and insufficient wetting are automatically detected. Using practical examples, we show how GÖPEL ASPECT™ technology quickly captures and evaluates high-resolution CT images.