Checking solder penetration at THT solder joints
‘THT inspection is like looking at icebergs,’ says Andreas Türk, Product Manager for Inspection Solutions at GÖPEL electronic. ‘Most of the solder joint is hidden – inside the circuit board.’
Visual inspection is not enough to reliably assess assembly quality – X-ray inspection is required. Even better: modern 3D CT directly inline, keeping pace with your production line.
In this webinar recording, we show how Multi Line AXI checks the solder penetration (barrel fill) at THT solder joints – fully automated, even on large, heavy boards with tall components. Learn how you can efficiently ensure the quality of your assemblies.
